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 Model Number |
MD2006A |
Features
- Fully automatic Decapsulation system : Milling, Etching, Rinsing and Ultrasonic Cleaning
- User friendly interface using GUI(PC system)
- Fast, dual heating process(Jig plate heating & IR beam heating)
- Accurate Decapsulation(Milling : minimum 0.01mm, Chemical etchant dispensing volume : minimum 0.005ml)
- Repetitions made simple using recipe files
- Safe operation(Decapping in chamber, Fume exhausting system)
- No need for consumable gaskets
- Minimal maintenance cost and long lifecycles
Specification
| Item |
Description |
| Dimension |
1,420(W) x 875(D) x 1,720(H)mm |
| Weight |
Approx. 250kg |
| Procedure |
Miling, Etching, Heating, Cleaning, Ultrasonic Cleaning, Inspection |
| HAndling IC Size |
2 x 2mm ~ 50 x 50mm(Minimum Milling Depth : Approx. 0.01mm) |
| Etchant |
Fuming Nitric Acid, Sulfuric Acid, Fuing Sulfuric Acid |
| Cleaning Solution |
Acetone |
| Heating Temperature |
1. Beam Heater : (Room Temp.) ~ 400°C |
| 2. Jig Heater : (Room Temp.) ~ 250°C, Free Control by Dual Heating System |
| Ultrasonic |
38~40 KHz |
| Process Time |
Milling : 1 ~ 2min., Etching~Cleaning : 3~15 min.(Average Time) |
| Utility |
Roted Voltage : AC220V/110V, 1Phase |
| Roted Current : 15A, Roted Frequency : 50~60Hz |
| Air Pressure : 6kg/㎠(bar), Fume Exhaust Line |
| De-linized Water Supply/Drain |
| Program |
User Interface : Window Based graphical User Interface |
| Applications |
BGA, PBGA, BOC, DIP, QFP, CSP, SCSP, MCM, TSOP and etc. |
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