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 Model Number |
MP2007A |
Features
- Multi layer etching equipment for Wafer(Die)
- User friendly interface using GUI(PC system)
- Repetitions made simple using recipe files
- Safe operation(Proceeded in chamber, Fume exhausting system)
- No need for consumable gaskets
- Minimal maintenance cost and long lifecycles
Specification
| Item |
Description |
| Dimension |
2,495(W) x 1,050(D) x 1,820(H)mm |
| Weight |
Approx. 650kg |
| Procedure |
Chemical Etching, Heating, De-lonized Water |
| N2 Cleaning, Ultrasonic Cleaning, Drying |
| Handling Water Size |
1 x 1mm ~ 30 x 30mm |
| Chemical Bath |
4ea Bath(2ea bath heating) |
| Heating Temperature |
Bath Heating Type(2ea bath) : Room Temp.) ~ 150°C |
| Cleaning System |
Ultrasonic & De-lonized Water |
| Dry System |
Air/N2 gas, Beam Heater |
| Utility |
Rated Voltage : AC220V/110V, 1Phase |
| Rated Current : 15A, Rated Frequency : 50 ~ 60Hz |
| Air Pressure : 6kg/㎠(bar), Fume Exhaust Line |
| De-lonized Water Supply/Drain |
| Program |
User Interface : Window Based Graphical User Interface |
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